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PDF) Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature

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PDF) Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature

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Chunyan NAN, University of Waterloo, Waterloo

PDF) Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding

Development of a fast method for optimization of Au ball bond process - ScienceDirect

Norman Y. Zhou's research works University of Waterloo, Waterloo

PDF) Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature

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Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

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