Figure 3 from Under Bump Metallurgy (UBM)-a technology review for

Figure 6 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Pb-Free Solders for Flip-Chip Interconnections

Schematic of a Cu pillar solder joint.

Pb-Free Solders for Flip-Chip Interconnections

UBM (under bump metallurgy) structure

Intermetallic compounds in 3D integrated circuits technology: a

Direct bump-on-copper process for flip chip technologies

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

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